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Chemical content 74AHCT138BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT138BQ-Q100SOT763-1DHVQFN1621.33984 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300198115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37415
PolymerResin systemProprietary0.0198419.900000.09295
subTotal0.09968100.000000.46710
DieDoped siliconSilicon (Si)7440-21-30.27813100.000001.30335
subTotal0.27813100.000001.30335
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.69199
Iron (Fe)7439-89-60.198052.400000.92809
Phosphorus (P)7723-14-00.002480.030000.01160
Zinc (Zn)7440-66-60.008250.100000.03867
subTotal8.25219100.0000038.67035
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69617
FillerSilica -amorphous-7631-86-90.434103.490002.03424
Silica fused60676-86-010.5503184.8200049.43950
PigmentCarbon black1333-86-40.019900.160000.09326
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62951
Epoxy resin systemProprietary0.197771.590000.92677
Phenolic resinProprietary0.279872.250001.31147
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.15664
subTotal12.43847100.0000058.28756
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00982
Nickel (Ni)7440-02-00.1906491.000000.89333
Palladium (Pd)7440-05-30.016768.000000.07853
subTotal0.20949100.000000.98168
WirePure metalCopper (Cu)7440-50-80.0597496.550000.27994
Pure metal layerGold (Au)7440-57-50.000220.350000.00101
Palladium (Pd)7440-05-30.001923.100000.00899
subTotal0.06187100.000000.28994
total21.33984100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.