Chemical content 74AHCT138D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT138D-Q100SOT109-1SO16144.28609 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300199118512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1602080.100000.11103
PolymerResin systemProprietary0.0398019.900000.02758
DieDoped siliconSilicon (Si)7440-21-30.38938100.000000.26987
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-850.6844097.4700035.12771
Iron (Fe)7439-89-61.248002.400000.86495
Phosphorus (P)7723-14-00.015600.030000.01081
Zinc (Zn)7440-66-60.052000.100000.03604
Mould CompoundAdditiveNon hazardousProprietary4.252094.700002.94699
FillerSilica fused60676-86-071.4713079.0000049.53444
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.428206.000003.76211
PigmentCarbon black1333-86-40.180940.200000.12540
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.618804.000002.50807
Non hazardousProprietary3.709274.100002.57077
Tetramethylbiphenyl diglycidyl ether85954-11-61.809402.000001.25404
Pre-PlatingPure metal layerGold (Au)7440-57-50.033003.000000.02287
Nickel (Ni)7440-02-01.0153092.300000.70367
Palladium (Pd)7440-05-30.034103.100000.02363
Silver (Ag)7440-22-40.017601.600000.01220
WirePure metalCopper (Cu)7440-50-80.12671100.000000.08782
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.