Chemical content 74AHCT139D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT139D-Q100SOT109-1SO16144.44380 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300679118512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.8569077.900000.59324
PolymerAcrylic resinProprietary0.1672015.200000.11575
Resin systemProprietary0.075906.900000.05255
DieDoped siliconSilicon (Si)7440-21-30.55407100.000000.38359
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-850.6844097.4700035.08936
Iron (Fe)7439-89-61.248002.400000.86400
Phosphorus (P)7723-14-00.015600.030000.01080
Zinc (Zn)7440-66-60.052000.100000.03600
Mould CompoundAdditiveNon hazardousProprietary4.252094.700002.94377
FillerSilica fused60676-86-071.4713079.0000049.48035
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.428206.000003.75800
PigmentCarbon black1333-86-40.180940.200000.12527
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.618804.000002.50533
Non hazardousProprietary3.709274.100002.56797
Tetramethylbiphenyl diglycidyl ether85954-11-61.809402.000001.25267
Pre-PlatingPure metal layerGold (Au)7440-57-50.006003.000000.00415
Nickel (Ni)7440-02-00.1846092.300000.12780
Palladium (Pd)7440-05-30.006203.100000.00429
Silver (Ag)7440-22-40.003201.600000.00222
WirePure metalCopper (Cu)7440-50-80.11973100.000000.08289
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.