Chemical content 74AHCT139PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT139PW-Q100SOT403-1TSSOP1660.74742 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300681118612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21800
PolymerAcrylic resinProprietary0.0258415.200000.04254
Resin systemProprietary0.011736.900000.01931
DieDoped siliconSilicon (Si)7440-21-30.55407100.000000.91208
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.79258
Iron (Fe)7439-89-60.475552.400000.78283
Phosphorus (P)7723-14-00.005940.030000.00979
Zinc (Zn)7440-66-60.019810.100000.03262
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.06383
FillerSilica fused60676-86-031.2840079.0000051.49848
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.91128
PigmentCarbon black1333-86-40.079200.200000.13038
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.60752
Non hazardousProprietary1.623604.100002.67271
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.30376
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02484
Nickel (Ni)7440-02-00.4642592.300000.76423
Palladium (Pd)7440-05-30.015593.100000.02567
Silver (Ag)7440-22-40.008051.600000.01325
WirePure metalCopper (Cu)7440-50-80.10589100.000000.17431
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.