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Chemical content 74AHCT14BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT14BQSOT762-1DHVQFN1417.66900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352737341152212601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31734
PolymerResin systemProprietary0.0139319.900000.07884
subTotal0.07000100.000000.39618
DieDoped siliconSilicon (Si)7440-21-30.21155100.000001.19727
subTotal0.21155100.000001.19727
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.4622697.4700036.57401
Iron (Fe)7439-89-60.159122.400000.90056
Phosphorus (P)7723-14-00.001990.030000.01126
Zinc (Zn)7440-66-60.006630.100000.03752
subTotal6.63000100.0000037.52335
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.73317
Silica fused60676-86-08.3936480.0920047.50490
PigmentCarbon black1333-86-40.097250.928000.55042
PolymerEpoxy resin systemProprietary0.885568.450005.01194
Phenolic resinProprietary0.267242.550001.51248
subTotal10.48000100.0000059.31291
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03735
Nickel (Ni)7440-02-00.2030692.300001.14924
Palladium (Pd)7440-05-30.006823.100000.03860
Silver (Ag)7440-22-40.003521.600000.01992
subTotal0.22000100.000001.24511
WirePure metalCopper (Cu)7440-50-80.05746100.000000.32520
subTotal0.05746100.000000.32520
total17.66900100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.