Chemical content 74AHCT14D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT14D-Q100SOT108-1SO14141.72671 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298497118912601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01649
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
DieDoped siliconSilicon (Si)7440-21-30.29684100.000000.20945
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.69022
Iron (Fe)7439-89-61.175702.400000.82955
Phosphorus (P)7723-14-00.014700.030000.01037
Zinc (Zn)7440-66-60.048990.100000.03456
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02058
FillerSilica fused60676-86-071.9567679.0000050.77148
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85606
PigmentCarbon black1333-86-40.182170.200000.12854
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57071
Non hazardousProprietary3.734464.100002.63498
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28535
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02632
Nickel (Ni)7440-02-01.1477892.300000.80985
Palladium (Pd)7440-05-30.038553.100000.02720
Silver (Ag)7440-22-40.019901.600000.01404
WirePure metalCopper (Cu)7440-50-80.08442100.000000.05956
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.