Chemical content 74AHCT157BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT157BQSOT763-1DHVQFN1621.55748 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352855711151012601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37038
PolymerResin systemProprietary0.0198419.900000.09202
DieDoped siliconSilicon (Si)7440-21-30.49869100.000002.31332
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.31222
Iron (Fe)7439-89-60.198062.400000.91874
Phosphorus (P)7723-14-00.002480.030000.01148
Zinc (Zn)7440-66-60.008250.100000.03828
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67904
FillerSilica -amorphous-7631-86-90.434103.490002.01370
Silica fused60676-86-010.5503084.8200048.94033
PigmentCarbon black1333-86-40.019900.160000.09232
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62315
Epoxy resin systemProprietary0.197771.590000.91741
Phenolic resinProprietary0.279872.250001.29823
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13486
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00972
Nickel (Ni)7440-02-00.1906391.000000.88427
Palladium (Pd)7440-05-30.016768.000000.07774
WirePure metalCopper (Cu)7440-50-80.0567796.550000.26336
Pure metal layerGold (Au)7440-57-50.000210.350000.00095
Palladium (Pd)7440-05-30.001823.100000.00846
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.