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Chemical content 74AHCT157D

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Type numberPackagePackage descriptionTotal product weight
74AHCT157DSOT109-1SO16143.01735 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352640001181312601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01634
PolymerAcrylic resinProprietary0.0045615.200000.00319
Resin systemProprietary0.002076.900000.00145
subTotal0.03000100.000000.02098
DieDoped siliconSilicon (Si)7440-21-30.35621100.000000.24907
subTotal0.35621100.000000.24907
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.67648
Iron (Fe)7439-89-60.904202.400000.63223
Phosphorus (P)7723-14-00.011300.030000.00790
Zinc (Zn)7440-66-60.037680.100000.02634
subTotal37.67500100.0000026.34295
Mould CompoundAdditiveNon hazardousProprietary4.900694.700003.42664
FillerSilica fused60676-86-082.3733079.0000057.59672
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.256206.000004.37443
PigmentCarbon black1333-86-40.208540.200000.14581
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.170804.000002.91629
Non hazardousProprietary4.275074.100002.98920
Tetramethylbiphenyl diglycidyl ether85954-11-62.085402.000001.45814
subTotal104.27000100.0000072.90723
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00395
Nickel (Ni)7440-02-00.5480597.000000.38321
Palladium (Pd)7440-05-30.011302.000000.00790
subTotal0.56500100.000000.39506
WirePure metalCopper (Cu)7440-50-80.12114100.000000.08470
subTotal0.12114100.000000.08470
total143.01735100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.