Chemical content 74AHCT157PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT157PWSOT403-1TSSOP1663.60629 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352640011181312601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62965
PolymerResin systemProprietary0.0995019.900000.15643
DieDoped siliconSilicon (Si)7440-21-30.49869100.000000.78403
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.23103
Iron (Fe)7439-89-60.912002.400001.43382
Phosphorus (P)7723-14-00.011400.030000.01792
Zinc (Zn)7440-66-60.038000.100000.05974
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.69952
FillerSilica fused60676-86-018.1700079.0000028.56636
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.16960
PigmentCarbon black1333-86-40.046000.200000.07232
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.44640
Non hazardousProprietary0.943004.100001.48256
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72320
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02358
Nickel (Ni)7440-02-01.4550097.000002.28751
Palladium (Pd)7440-05-30.030002.000000.04717
WirePure metalCopper (Cu)7440-50-80.10759100.000000.16915
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.