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Chemical content 74AHCT17APW

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Type numberPackagePackage descriptionTotal product weight
74AHCT17APWSOT402-1TSSOP1456.22350 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935338682118912601235Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.5126480.100000.91179
PolymerResin systemProprietary0.1273619.900000.22652
subTotal0.64000100.000001.13831
DieDoped siliconSilicon (Si)7440-21-30.24327100.000000.43269
subTotal0.24327100.000000.43269
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.40595
Iron (Fe)7439-89-60.504002.400000.89642
Phosphorus (P)7723-14-00.006300.030000.01121
Zinc (Zn)7440-66-60.021000.100000.03735
subTotal21.00000100.0000037.35093
Mould CompoundAdditiveNon hazardousProprietary1.593304.700002.83387
FillerSilica fused60676-86-026.7810079.0000047.63311
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.034006.000003.61770
PigmentCarbon black1333-86-40.067800.200000.12059
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.356004.000002.41180
Non hazardousProprietary1.389904.100002.47210
Tetramethylbiphenyl diglycidyl ether85954-11-60.678002.000001.20590
subTotal33.90000100.0000060.29507
Pre-PlatingPure metal layerGold (Au)7440-57-50.003501.000000.00623
Nickel (Ni)7440-02-00.3395097.000000.60384
Palladium (Pd)7440-05-30.007002.000000.01245
subTotal0.35000100.000000.62252
WirePure metalCopper (Cu)7440-50-80.09023100.000000.16049
subTotal0.09023100.000000.16049
total56.22350100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.