Chemical content 74AHCT1G04GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT1G04GV-Q100SOT753SO510.38174 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300718125412601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07224
PolymerResin systemProprietary0.0025025.000000.02408
DieDoped siliconSilicon (Si)7440-21-30.06536100.000000.62953
Lead FrameCopper alloyLead (Pb)7439-92-10.001010.030000.00971
Phosphorus (P)7723-14-00.005040.150000.04855
Iron (Fe)7439-89-60.085682.550000.82530
Tin (Sn)7440-31-50.006720.200000.06473
Copper (Cu)7440-50-83.1906694.9600030.73335
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68289
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.31627
PigmentCarbon black1333-86-40.019440.300000.18725
PolymerPhenolic resinProprietary0.583209.000005.61756
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.29620
Post-PlatingImpurityCopper (Cu)7440-50-80.000000.001000.00004
Bismuth (Bi)7440-69-90.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Antimony (Sb)7440-36-00.000010.003000.00013
Tin solderTin (Sn)7440-31-50.4399699.990004.23779
WireGold alloyPalladium (Pd)7440-05-30.000261.000000.00254
Gold (Au)7440-57-50.0261299.000000.25161
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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