Chemical content 74AHCT1G125GV

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Type numberPackagePackage descriptionTotal product weight
74AHCT1G125GVSOT753SO510.39664 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352716601251712601235Hsin-chu, Taiwan; Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07214
PolymerResin systemProprietary0.0025025.000000.02405
DieDoped siliconSilicon (Si)7440-21-30.07360100.000000.70797
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.68930
Iron (Fe)7439-89-60.085682.550000.82411
Lead (Pb)7439-92-10.001010.030000.00970
Phosphorus (P)7723-14-00.005040.150000.04848
Tin (Sn)7440-31-50.006720.200000.06464
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68191
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.25276
PigmentCarbon black1333-86-40.019440.300000.18698
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.27858
Phenolic resinProprietary0.583209.000005.60950
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.23171
WireGold alloyGold (Au)7440-57-50.0327099.000000.31457
Palladium (Pd)7440-05-30.000331.000000.00318
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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