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Chemical content 74AHCT1G79GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT1G79GW-Q100SOT353-1UMT55.67284 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300084125612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12851
PolymerResin systemProprietary0.0024325.000000.04284
subTotal0.00972100.000000.17135
DieDoped siliconSilicon (Si)7440-21-30.08038100.000001.41702
subTotal0.08038100.000001.41702
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.62950
Iron (Fe)7439-89-60.045512.310000.80219
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02431
Zinc (Zn)7440-66-60.002360.120000.04167
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22572
subTotal1.97000100.0000034.72686
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.11939
Silica fused60676-86-02.3217570.5700040.92752
PigmentCarbon black1333-86-40.006580.200000.11599
PolymerEpoxy resin systemProprietary0.5010715.230008.83274
subTotal3.29000100.0000057.99564
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46409
subTotal0.31000100.000005.46462
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0127399.990000.22441
subTotal0.01273100.000000.22443
total5.67284100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.