Chemical content 74AHCT257PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT257PW-Q100SOT403-1TSSOP1660.47069 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300738118712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21900
PolymerAcrylic resinProprietary0.0258415.200000.04273
Resin systemProprietary0.011736.900000.01940
DieDoped siliconSilicon (Si)7440-21-30.27013100.000000.44671
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.93807
Iron (Fe)7439-89-60.475552.400000.78641
Phosphorus (P)7723-14-00.005940.030000.00983
Zinc (Zn)7440-66-60.019810.100000.03277
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.07785
FillerSilica fused60676-86-031.2840079.0000051.73415
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.92918
PigmentCarbon black1333-86-40.079200.200000.13097
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.61945
Non hazardousProprietary1.623604.100002.68494
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.30973
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02495
Nickel (Ni)7440-02-00.4642592.300000.76773
Palladium (Pd)7440-05-30.015593.100000.02579
Silver (Ag)7440-22-40.008051.600000.01331
WirePure metalCopper (Cu)7440-50-80.11310100.000000.18704
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.