Chemical content 74AHCT2G126DC

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Type numberPackagePackage descriptionTotal product weight
74AHCT2G126DCSOT765-1VSSOP89.94346 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352751351251112601235Ayutthaya, Thailand; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28871
PolymerResin systemProprietary0.0071319.900000.07173
DieDoped siliconSilicon (Si)7440-21-30.09238100.000000.92907
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.17875
Nickel (Ni)7440-02-00.105113.000001.05707
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.92220
FillerSilica fused60676-86-04.8840279.0000049.11788
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.73047
PigmentCarbon black1333-86-40.012360.200000.12435
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.48698
Non hazardousProprietary0.253474.100002.54916
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.24349
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03106
Nickel (Ni)7440-02-00.0950292.300000.95563
Palladium (Pd)7440-05-30.003193.100000.03210
Silver (Ag)7440-22-40.001651.600000.01657
WirePure metalCopper (Cu)7440-50-80.02633100.000000.26478
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.