Chemical content 74AHCT32BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT32BQ-Q100SOT762-1DHVQFN1418.25811 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300208115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10204
PolymerResin systemProprietary0.0046319.900000.02535
DieDoped siliconSilicon (Si)7440-21-30.28449100.000001.55817
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.94090
Iron (Fe)7439-89-60.166072.400000.90959
Phosphorus (P)7723-14-00.002080.030000.01137
Zinc (Zn)7440-66-60.006920.100000.03790
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.67669
FillerSilica -amorphous-7631-86-90.367153.490002.01088
Silica fused60676-86-08.9230784.8200048.87183
PigmentCarbon black1333-86-40.016830.160000.09219
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62228
Epoxy resin systemProprietary0.167271.590000.91613
Phenolic resinProprietary0.236702.250001.29641
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.13188
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07581
Nickel (Ni)7440-02-00.4258792.300002.33251
Palladium (Pd)7440-05-30.014303.100000.07834
Silver (Ag)7440-22-40.007381.600000.04043
WirePure metalCopper (Cu)7440-50-80.0474796.550000.26000
Pure metal layerGold (Au)7440-57-50.000170.350000.00094
Palladium (Pd)7440-05-30.001523.100000.00835
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.