Chemical content 74AHCT32BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT32BQSOT762-1DHVQFN1418.03371 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352764541151612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10331
PolymerResin systemProprietary0.0046319.900000.02567
DieDoped siliconSilicon (Si)7440-21-30.28449100.000001.57756
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.72364
Iron (Fe)7439-89-60.167512.400000.92887
Phosphorus (P)7723-14-00.002090.030000.01161
Zinc (Zn)7440-66-60.006980.100000.03870
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69755
FillerSilica -amorphous-7631-86-90.367153.490002.03590
Silica fused60676-86-08.9230684.8200049.47991
PigmentCarbon black1333-86-40.016830.160000.09334
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63002
Epoxy resin systemProprietary0.167271.590000.92753
Phenolic resinProprietary0.236702.250001.31254
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.15840
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00982
Nickel (Ni)7440-02-00.1612391.000000.89405
Palladium (Pd)7440-05-30.014178.000000.07860
WirePure metalCopper (Cu)7440-50-80.0475396.550000.26357
Pure metal layerGold (Au)7440-57-50.000170.350000.00096
Palladium (Pd)7440-05-30.001533.100000.00846
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.