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Chemical content 74AHCT32PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT32PWSOT402-1TSSOP1452.03136 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352626411181312601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05989
PolymerAcrylic resinProprietary0.0060815.200000.01169
Resin systemProprietary0.002766.900000.00530
subTotal0.04000100.000000.07688
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.76548
subTotal0.39829100.000000.76548
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.60415
Iron (Fe)7439-89-60.468962.400000.90130
Phosphorus (P)7723-14-00.005860.030000.01127
Zinc (Zn)7440-66-60.019540.100000.03755
subTotal19.54000100.0000037.55427
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.86166
FillerSilica fused60676-86-025.0272079.0000048.10022
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.65318
PigmentCarbon black1333-86-40.063360.200000.12177
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.43545
Non hazardousProprietary1.298884.100002.49634
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.21773
subTotal31.68000100.0000060.88635
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00557
Nickel (Ni)7440-02-00.2813097.000000.54064
Palladium (Pd)7440-05-30.005802.000000.01115
subTotal0.29000100.000000.55736
WirePure metalCopper (Cu)7440-50-80.08307100.000000.15965
subTotal0.08307100.000000.15965
total52.03136100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.