Chemical content 74AHCT374PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT374PW-Q100SOT360-1TSSOP20101.35552 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301387118512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6359077.900001.61402
PolymerAcrylic resinProprietary0.3192015.200000.31493
Resin systemProprietary0.144906.900000.14296
DieDoped siliconSilicon (Si)7440-21-30.50463100.000000.49788
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-838.9880097.4700038.46658
Iron (Fe)7439-89-60.960002.400000.94716
Phosphorus (P)7723-14-00.012000.030000.01184
Zinc (Zn)7440-66-60.040000.100000.03947
Mould CompoundAdditiveNon hazardousProprietary2.684404.700002.64850
FillerSilica fused60676-86-045.1208579.0000044.51741
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.426906.000003.38107
PigmentCarbon black1333-86-40.114230.200000.11270
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.284604.000002.25405
Non hazardousProprietary2.341724.100002.31040
Tetramethylbiphenyl diglycidyl ether85954-11-61.142302.000001.12702
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.04440
Nickel (Ni)7440-02-01.3845092.300001.36598
Palladium (Pd)7440-05-30.046503.100000.04588
Silver (Ag)7440-22-40.024001.600000.02368
WirePure metalCopper (Cu)7440-50-80.13589100.000000.13407
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.