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Chemical content 74AHCT541BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT541BQSOT764-1DHVQFN2027.51718 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855451151412601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0961280.100000.34931
PolymerResin systemProprietary0.0238819.900000.08678
subTotal0.12000100.000000.43609
DieDoped siliconSilicon (Si)7440-21-30.46205100.000001.67912
subTotal0.46205100.000001.67912
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-89.9906897.4700036.30705
Iron (Fe)7439-89-60.246002.400000.89399
Phosphorus (P)7723-14-00.003080.030000.01117
Zinc (Zn)7440-66-60.010250.100000.03725
subTotal10.25000100.0000037.24946
Mould CompoundFillerSilica -amorphous-7631-86-91.295957.980004.70961
Silica fused60676-86-013.0069480.0920047.26844
PigmentCarbon black1333-86-40.150710.928000.54768
PolymerEpoxy resin systemProprietary1.372288.450004.98699
Phenolic resinProprietary0.414122.550001.50495
subTotal16.24000100.0000059.01767
Pre-PlatingPure metal layerGold (Au)7440-57-50.010503.000000.03816
Nickel (Ni)7440-02-00.3230592.300001.17399
Palladium (Pd)7440-05-30.010853.100000.03943
Silver (Ag)7440-22-40.005601.600000.02035
subTotal0.35000100.000001.27193
WirePure metalCopper (Cu)7440-50-80.09513100.000000.34571
subTotal0.09513100.000000.34571
total27.51718100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.