Chemical content 74AHCT541PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT541PW-Q100SOT360-1TSSOP20101.28541 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300709118512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6359077.900001.61514
PolymerAcrylic resinProprietary0.3192015.200000.31515
Resin systemProprietary0.144906.900000.14306
DieDoped siliconSilicon (Si)7440-21-30.46205100.000000.45618
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-838.9880097.4700038.49320
Iron (Fe)7439-89-60.960002.400000.94782
Phosphorus (P)7723-14-00.012000.030000.01185
Zinc (Zn)7440-66-60.040000.100000.03949
Mould CompoundAdditiveNon hazardousProprietary2.684404.700002.65034
FillerSilica fused60676-86-045.1208579.0000044.54822
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.426906.000003.38341
PigmentCarbon black1333-86-40.114230.200000.11278
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.284604.000002.25561
Non hazardousProprietary2.341724.100002.31200
Tetramethylbiphenyl diglycidyl ether85954-11-61.142302.000001.12780
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.04443
Nickel (Ni)7440-02-01.3845092.300001.36693
Palladium (Pd)7440-05-30.046503.100000.04591
Silver (Ag)7440-22-40.024001.600000.02370
WirePure metalCopper (Cu)7440-50-80.10837100.000000.10699
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.