Chemical content 74AHCT573PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT573PW-Q100SOT360-1TSSOP2083.38646 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300321118712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03737
PolymerAcrylic resinProprietary0.0060815.200000.00729
Resin systemProprietary0.002766.900000.00331
DieDoped siliconSilicon (Si)7440-21-30.41961100.000000.50321
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.73081
Iron (Fe)7439-89-60.733632.400000.87980
Phosphorus (P)7723-14-00.009170.030000.01100
Zinc (Zn)7440-66-60.030570.100000.03666
Mould CompoundAdditiveNon hazardousProprietary2.419564.700002.90162
FillerSilica fused60676-86-040.6692079.0000048.77195
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.088806.000003.70420
PigmentCarbon black1333-86-40.102960.200000.12347
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.059204.000002.46947
Non hazardousProprietary2.110684.100002.53120
Tetramethylbiphenyl diglycidyl ether85954-11-61.029602.000001.23473
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02792
Nickel (Ni)7440-02-00.7162192.300000.85891
Palladium (Pd)7440-05-30.024053.100000.02885
Silver (Ag)7440-22-40.012421.600000.01489
WirePure metalCopper (Cu)7440-50-80.10286100.000000.12335
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.