Chemical content 74AHCT595PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT595PWSOT403-1TSSOP1663.34268 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352655601181412601235Shanghai, China; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.63228
PolymerResin systemProprietary0.0995019.900000.15708
DieDoped siliconSilicon (Si)7440-21-30.24815100.000000.39175
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.47337
Iron (Fe)7439-89-60.912002.400001.43979
Phosphorus (P)7723-14-00.011400.030000.01800
Zinc (Zn)7440-66-60.038000.100000.05999
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.70659
FillerSilica fused60676-86-018.1700079.0000028.68524
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.17863
PigmentCarbon black1333-86-40.046000.200000.07262
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.45242
Non hazardousProprietary0.943004.100001.48873
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72621
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02368
Nickel (Ni)7440-02-01.4550097.000002.29703
Palladium (Pd)7440-05-30.030002.000000.04736
WirePure metalCopper (Cu)7440-50-80.09454100.000000.14925
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.