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Chemical content 74AHCV541ABQ

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Type numberPackagePackage descriptionTotal product weight
74AHCV541ABQSOT764-1DHVQFN2027.94788 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353067981151412601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24442
PolymerResin systemProprietary0.0169719.900000.06072
subTotal0.08528100.000000.30514
DieDoped siliconSilicon (Si)7440-21-30.25933100.000000.92792
subTotal0.25933100.000000.92792
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.88896
Iron (Fe)7439-89-60.260742.400000.93294
Phosphorus (P)7723-14-00.003260.030000.01166
Zinc (Zn)7440-66-60.010860.100000.03887
subTotal10.86402100.0000038.87243
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70499
FillerSilica -amorphous-7631-86-90.571483.490002.04482
Silica fused60676-86-013.8892084.8200049.69679
PigmentCarbon black1333-86-40.026200.160000.09375
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63278
Epoxy resin systemProprietary0.260361.590000.93160
Phenolic resinProprietary0.368442.250001.31829
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16786
subTotal16.37491100.0000058.59088
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00987
Nickel (Ni)7440-02-00.2509591.000000.89792
Palladium (Pd)7440-05-30.022068.000000.07894
subTotal0.27577100.000000.98673
WirePure metalCopper (Cu)7440-50-80.0855196.550000.30598
Pure metal layerGold (Au)7440-57-50.000310.350000.00111
Palladium (Pd)7440-05-30.002753.100000.00982
subTotal0.08857100.000000.31691
total27.94788100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.