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Chemical content 74ALVC244PW

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Type numberPackagePackage descriptionTotal product weight
74ALVC244PWSOT360-1TSSOP2095.36144 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352697251181512601235Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6821080.100001.76392
PolymerResin systemProprietary0.4179019.900000.43823
subTotal2.10000100.000002.20215
DieDoped siliconSilicon (Si)7440-21-30.57933100.000000.60751
subTotal0.57933100.000000.60751
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-835.0892097.4700036.79600
Iron (Fe)7439-89-60.864002.400000.90603
Phosphorus (P)7723-14-00.010800.030000.01133
Zinc (Zn)7440-66-60.036000.100000.03775
subTotal36.00000100.0000037.75111
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-748.6750088.5000051.04264
Flame retardantNon hazardousProprietary1.650003.000001.73026
PolymerEpoxy resin systemProprietary4.675008.500004.90240
subTotal55.00000100.0000057.67530
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.01573
Nickel (Ni)7440-02-01.4550097.000001.52577
Palladium (Pd)7440-05-30.030002.000000.03146
subTotal1.50000100.000001.57296
WirePure metalGold (Au)7440-57-50.1802899.000000.18905
Palladium (Pd)7440-05-30.001821.000000.00191
subTotal0.18210100.000000.19096
total95.36144100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.