Chemical content 74ALVC32PW

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Type numberPackagePackage descriptionTotal product weight
74ALVC32PWSOT402-1TSSOP1451.97268 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352697291181412601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05995
PolymerAcrylic resinProprietary0.0060815.200000.01170
Resin systemProprietary0.002766.900000.00531
DieDoped siliconSilicon (Si)7440-21-30.35253100.000000.67830
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.64548
Iron (Fe)7439-89-60.468962.400000.90232
Phosphorus (P)7723-14-00.005860.030000.01128
Zinc (Zn)7440-66-60.019540.100000.03760
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36573
Silica fused60676-86-024.8149478.3300047.74613
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.71826
PigmentCarbon black1333-86-40.063360.200000.12191
PolymerEpoxy resin systemProprietary2.807488.862005.40184
Phenolic resinProprietary1.871655.908003.60123
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00558
Nickel (Ni)7440-02-00.2813097.000000.54125
Palladium (Pd)7440-05-30.005802.000000.01116
WirePure metalCopper (Cu)7440-50-80.07016100.000000.13498
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.