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Chemical content 74ALVC573PW

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Type numberPackagePackage descriptionTotal product weight
74ALVC573PWSOT360-1TSSOP2095.28210 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352697361181312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6821080.100001.76539
PolymerResin systemProprietary0.4179019.900000.43859
subTotal2.10000100.000002.20398
DieDoped siliconSilicon (Si)7440-21-30.50000100.000000.52476
subTotal0.50000100.000000.52476
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-835.0892097.4700036.82664
Iron (Fe)7439-89-60.864002.400000.90678
Phosphorus (P)7723-14-00.010800.030000.01133
Zinc (Zn)7440-66-60.036000.100000.03778
subTotal36.00000100.0000037.78253
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-748.6750088.5000051.08515
Flame retardantNon hazardousProprietary1.650003.000001.73170
PolymerEpoxy resin systemProprietary4.675008.500004.90648
subTotal55.00000100.0000057.72333
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.01574
Nickel (Ni)7440-02-01.4550097.000001.52704
Palladium (Pd)7440-05-30.030002.000000.03149
subTotal1.50000100.000001.57427
WirePure metalGold (Au)7440-57-50.1802899.000000.18921
Palladium (Pd)7440-05-30.001821.000000.00191
subTotal0.18210100.000000.19112
total95.28210100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.