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Chemical content 74ALVCH16373DGG

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Type numberPackagePackage descriptionTotal product weight
74ALVCH16373DGGSOT362-1TSSOP48194.21001 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352051201181412601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.3692080.100003.79445
PolymerResin systemProprietary1.8308019.900000.94269
subTotal9.20000100.000004.73714
DieDoped siliconSilicon (Si)7440-21-31.09603100.000000.56435
subTotal1.09603100.000000.56435
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.6500097.0000022.47567
Nickel (Ni)7440-02-01.350003.000000.69512
subTotal45.00000100.0000023.17079
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-7119.4750088.5000061.51846
Flame retardantNon hazardousProprietary4.050003.000002.08537
PolymerEpoxy resin systemProprietary11.475008.500005.90855
subTotal135.00000100.0000069.51238
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.01648
Nickel (Ni)7440-02-03.1040097.000001.59827
Palladium (Pd)7440-05-30.064002.000000.03295
subTotal3.20000100.000001.64770
WirePure metalGold (Au)7440-57-50.7068499.000000.36396
Palladium (Pd)7440-05-30.007141.000000.00368
subTotal0.71398100.000000.36764
total194.21001100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.