Chemical content 74AUP1G158GW

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Type numberPackagePackage descriptionTotal product weight
74AUP1G158GWSOT363-2SC-885.59992 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352799721251512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.13139
PolymerResin systemProprietary0.0024525.000000.04380
DieDoped siliconSilicon (Si)7440-21-30.12027100.000002.14779
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400036.48845
Iron (Fe)7439-89-60.048742.310000.87039
Lead (Pb)7439-92-10.000210.010000.00377
Phosphorus (P)7723-14-00.001480.070000.02638
Zinc (Zn)7440-66-60.002530.120000.04521
Pure metal layerSilver (Ag)7440-22-40.013720.650000.24491
Mould CompoundFillerSilica -amorphous-7631-86-91.0415835.0700018.59989
Silica fused60676-86-01.3020543.8400023.25119
PigmentCarbon black1333-86-40.007420.250000.13259
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.2970010.000005.30365
Phenol Formaldehyde resin (generic)9003-35-40.295229.940005.27183
Polyethylene (PE) -wax-9002-88-40.026730.900000.47733
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00033
Tin solderTin (Sn)7440-31-50.3699699.990006.60658
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0198399.990000.35412
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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