×

Chemical content 74AUP1G32GW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G32GWSOT353-1UMT55.46900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527902612516126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.13714
PolymerResin systemProprietary0.0025025.000000.04571
subTotal0.01000100.000000.18285
DieDoped siliconSilicon (Si)7440-21-30.05470100.000001.00025
subTotal0.05470100.000001.00025
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200034.80369
Iron (Fe)7439-89-60.041962.130000.76725
Phosphorus (P)7723-14-00.000590.030000.01081
Zinc (Zn)7440-66-60.002560.130000.04683
MetallisationSilver (Ag)7440-22-40.021471.090000.39263
subTotal1.97000100.0000036.02121
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.64911
Triphenylphosphine603-35-00.001560.050000.02843
FillerSilica -amorphous-7631-86-92.2392072.0000040.94350
PigmentCarbon black1333-86-40.001560.050000.02843
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000008.52990
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000005.68660
subTotal3.11000100.0000056.86597
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.66775
subTotal0.31000100.000005.66832
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0143099.990000.26139
subTotal0.01430100.000000.26142
total5.46900100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.