Chemical content 74AUP1G32GW

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Type numberPackagePackage descriptionTotal product weight
74AUP1G32GWSOT353-1UMT55.46900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93527902612516126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.13714
PolymerResin systemProprietary0.0025025.000000.04571
DieDoped siliconSilicon (Si)7440-21-30.05470100.000001.00025
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200034.80369
Iron (Fe)7439-89-60.041962.130000.76725
Phosphorus (P)7723-14-00.000590.030000.01081
Zinc (Zn)7440-66-60.002560.130000.04683
MetallisationSilver (Ag)7440-22-40.021471.090000.39263
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.64911
FillerSilica -amorphous-7631-86-92.2392072.0000040.94350
PigmentCarbon black1333-86-40.001560.050000.02843
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000008.52990
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000005.68660
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.66775
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0143099.990000.26139
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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