Chemical content 74AUP1G373GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1G373GW-Q100SOT363-2SC-885.77034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935303015125712601235Shanghai, China; Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12751
PolymerResin systemProprietary0.0024525.000000.04250
DieDoped siliconSilicon (Si)7440-21-30.12027100.000002.08436
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.41081
Iron (Fe)7439-89-60.048742.310000.84468
Lead (Pb)7439-92-10.000210.010000.00366
Phosphorus (P)7723-14-00.001480.070000.02560
Zinc (Zn)7440-66-60.002530.120000.04388
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23768
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.61827
Silica fused60676-86-02.2159070.5700038.40152
PigmentCarbon black1333-86-40.006280.200000.10883
PolymerEpoxy resin systemProprietary0.291719.290005.05527
Phenolic resinProprietary0.186525.940003.23232
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.41146
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0202599.990000.35099
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.