Chemical content 74AUP1G74DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1G74DC-Q100SOT765-1VSSOP89.95410 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353066051251012601235Ayutthaya, Thailand; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28840
PolymerResin systemProprietary0.0071319.900000.07165
DieDoped siliconSilicon (Si)7440-21-30.10136100.000001.01822
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.14221
Nickel (Ni)7440-02-00.105113.000001.05594
Mould CompoundFillerSilica -amorphous-7631-86-90.037090.600000.37265
Silica fused60676-86-04.8426078.3300048.64926
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.377126.100003.78859
PigmentCarbon black1333-86-40.012360.200000.12422
PolymerEpoxy resin systemProprietary0.547888.862005.50402
Phenolic resinProprietary0.365255.908003.66935
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03103
Nickel (Ni)7440-02-00.0950292.300000.95461
Palladium (Pd)7440-05-30.003193.100000.03206
Silver (Ag)7440-22-40.001651.600000.01655
WirePure metalCopper (Cu)7440-50-80.02799100.000000.28122
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.