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Chemical content 74AUP1G885DC

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Type numberPackagePackage descriptionTotal product weight
74AUP1G885DCSOT765-1VSSOP89.98656 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935280765125812601235Bangkok, Thailand; Suzhou, China; Ayutthaya, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28746
PolymerResin systemProprietary0.0071319.900000.07142
subTotal0.03584100.000000.35888
DieDoped siliconSilicon (Si)7440-21-30.13514100.000001.35322
subTotal0.13514100.000001.35322
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.03124
Nickel (Ni)7440-02-00.105113.000001.05251
subTotal3.50366100.0000035.08375
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.90959
FillerSilica fused60676-86-04.8840279.0000048.90590
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71437
PigmentCarbon black1333-86-40.012360.200000.12381
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47625
Non hazardousProprietary0.253474.100002.53815
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23812
subTotal6.18230100.0000061.90619
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03093
Nickel (Ni)7440-02-00.0950292.300000.95151
Palladium (Pd)7440-05-30.003193.100000.03196
Silver (Ag)7440-22-40.001651.600000.01649
subTotal0.10295100.000001.03089
WirePure metalCopper (Cu)7440-50-80.02667100.000000.26709
subTotal0.02667100.000000.26709
total9.98656100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.