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Chemical content 74AUP2G02DC

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Type numberPackagePackage descriptionTotal product weight
74AUP2G02DCSOT765-1VSSOP89.98788 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352807081251212601235Bangkok, Thailand; Ayutthaya, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28743
PolymerResin systemProprietary0.0071319.900000.07141
subTotal0.03584100.000000.35884
DieDoped siliconSilicon (Si)7440-21-30.13514100.000001.35304
subTotal0.13514100.000001.35304
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.02674
Nickel (Ni)7440-02-00.105113.000001.05237
subTotal3.50366100.0000035.07911
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.90921
FillerSilica fused60676-86-04.8840279.0000048.89944
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71388
PigmentCarbon black1333-86-40.012360.200000.12380
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47592
Non hazardousProprietary0.253474.100002.53782
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23796
subTotal6.18230100.0000061.89803
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03092
Nickel (Ni)7440-02-00.0950292.300000.95138
Palladium (Pd)7440-05-30.003193.100000.03195
Silver (Ag)7440-22-40.001651.600000.01649
subTotal0.10295100.000001.03074
WirePure metalCopper (Cu)7440-50-80.02799100.000000.28027
subTotal0.02799100.000000.28027
total9.98788100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.