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Chemical content 74AVC1T1022DP

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Type numberPackagePackage descriptionTotal product weight
74AVC1T1022DPSOT552-1TSSOP1023.39176 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935305831118812601235Bangkok, Thailand; Suzhou, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.7209080.100003.08185
PolymerResin systemProprietary0.1791019.900000.76565
subTotal0.90000100.000003.84750
DieDoped siliconSilicon (Si)7440-21-30.17761100.000000.75927
subTotal0.17761100.000000.75927
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.8950797.4700033.75150
Iron (Fe)7439-89-60.194402.400000.83106
Phosphorus (P)7723-14-00.002430.030000.01039
Zinc (Zn)7440-66-60.008100.100000.03463
subTotal8.10000100.0000034.62758
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-711.5050088.5000049.18399
Flame retardantNon hazardousProprietary0.390003.000001.66725
PolymerEpoxy resin systemProprietary1.105008.500004.72389
subTotal13.00000100.0000055.57513
Pre-PlatingPure metal layerGold (Au)7440-57-50.011001.000000.04703
Nickel (Ni)7440-02-01.0670097.000004.56144
Palladium (Pd)7440-05-30.022002.000000.09405
subTotal1.10000100.000004.70252
WirePure metalGold (Au)7440-57-50.1130199.000000.48314
Palladium (Pd)7440-05-30.001141.000000.00488
subTotal0.11416100.000000.48802
total23.39176100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.