Chemical content 74AVC2T45GT-Q100

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Type numberPackagePackage descriptionTotal product weight
74AVC2T45GT-Q100SOT833-1XSON82.50340 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9356908621155126030 s123520 s3Bangkok, Thailand; Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Seremban, Malaysia; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09527100.000003.80577
ComponentAdditiveNon hazardousProprietary0.000755.000000.02996
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02996
Silica -amorphous-7631-86-90.0075050.000000.29959
PolymerEpoxy resin systemProprietary0.0045030.000000.17976
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05992
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.30427
Magnesium (Mg)7439-95-40.001530.145700.06129
Nickel (Ni)7440-02-00.030682.914001.22571
Silicon (Si)7440-21-30.006650.631400.26558
Pure metal layerGold (Au)7440-57-50.000370.035000.01472
Nickel (Ni)7440-02-00.028562.712001.14074
Palladium (Pd)7440-05-30.001260.120000.05048
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21324
FillerSilica -amorphous-7631-86-90.003780.290000.15083
Silica fused60676-86-01.1216786.1500044.80598
HardenerPhenolic resinProprietary0.055864.290002.23120
PigmentCarbon black1333-86-40.002470.190000.09882
PolymerEpoxy resin systemProprietary0.112888.670004.50920
WireGold alloyGold (Au)7440-57-50.0377499.000001.50770
Palladium (Pd)7440-05-30.000381.000000.01523
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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