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Chemical content 74AVC4T245BZ

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Type numberPackagePackage descriptionTotal product weight
74AVC4T245BZSOT8016-1DHXQFN166.51408 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691143115612601235Nijmegen, Netherlands; Suzhou, China; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0115060.000000.17657
ImpurityNon hazardousProprietary0.000010.039500.00012
PolymerResin systemProprietary0.0076639.951410.11757
subTotal0.01917100.000000.29426
DieDoped siliconSilicon (Si)7440-21-30.14488100.000002.22413
subTotal0.14488100.000002.22413
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.0022197.0000046.08798
Nickel (Ni)7440-02-00.092853.000001.42540
subTotal3.09506100.0000047.51338
Mould CompoundAdditiveNon hazardousProprietary0.093752.900001.43919
FillerSilica fused60676-86-02.8755488.9500044.14346
PigmentCarbon black1333-86-40.004850.150000.07444
PolymerEpoxy resin systemProprietary0.047521.470000.72952
Phenolic resinProprietary0.100543.110001.54341
Tetramethylbiphenyl diglycidyl ether85954-11-60.110563.420001.69725
subTotal3.23276100.0000049.62727
Pre-PlatingPure metal layerGold (Au)7440-57-50.000161.000000.00248
Nickel (Ni)7440-02-00.0147291.000000.22603
Palladium (Pd)7440-05-30.001298.000000.01987
subTotal0.01618100.000000.24838
WirePure metalCopper (Cu)7440-50-80.0058296.550000.08931
Pure metal layerGold (Au)7440-57-50.000020.350000.00032
Palladium (Pd)7440-05-30.000193.100000.00287
subTotal0.00603100.000000.09250
total6.51408100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.