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Chemical content 74AVC4T3144GU12

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Type numberPackagePackage descriptionTotal product weight
74AVC4T3144GU12SOT1174-1XQFN124.36995 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690174115712601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.39762
ImpurityNon hazardousProprietary0.000010.039500.00026
PolymerResin systemProprietary0.0115739.951410.26476
subTotal0.02896100.000000.66264
DieDoped siliconSilicon (Si)7440-21-30.15462100.000003.53823
subTotal0.15462100.000003.53823
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000048.78446
Nickel (Ni)7440-02-00.065933.000001.50880
subTotal2.19779100.0000050.29326
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.19130
FillerSilica fused60676-86-01.5967888.9500036.53994
PigmentCarbon black1333-86-40.002690.150000.06162
PolymerEpoxy resin systemProprietary0.026391.470000.60386
Phenolic resinProprietary0.055833.110001.27756
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.40491
subTotal1.79514100.0000041.07919
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02703
Nickel (Ni)7440-02-00.1074891.000002.45953
Palladium (Pd)7440-05-30.009458.000000.21622
subTotal0.11811100.000002.70278
WirePure metalGold (Au)7440-57-50.0745899.000001.70672
Palladium (Pd)7440-05-30.000751.000000.01724
subTotal0.07534100.000001.72396
total4.36995100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.