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Chemical content 74AVC4T774BQ

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Type numberPackagePackage descriptionTotal product weight
74AVC4T774BQSOT763-1DHVQFN1621.40496 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353413261151012601235Shanghai, China; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37301
PolymerResin systemProprietary0.0198419.900000.09267
subTotal0.09968100.000000.46568
DieDoped siliconSilicon (Si)7440-21-30.33133100.000001.54789
subTotal0.33133100.000001.54789
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.57809
Iron (Fe)7439-89-60.198062.400000.92528
Phosphorus (P)7723-14-00.002480.030000.01157
Zinc (Zn)7440-66-60.008250.100000.03855
subTotal8.25236100.0000038.55349
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69101
FillerSilica -amorphous-7631-86-90.434103.490002.02805
Silica fused60676-86-010.5503084.8200049.28905
PigmentCarbon black1333-86-40.019900.160000.09298
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62759
Epoxy resin systemProprietary0.197771.590000.92395
Phenolic resinProprietary0.279872.250001.30748
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.15008
subTotal12.43846100.0000058.11019
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00979
Nickel (Ni)7440-02-00.1906391.000000.89057
Palladium (Pd)7440-05-30.016768.000000.07829
subTotal0.20948100.000000.97865
WirePure metalCopper (Cu)7440-50-80.0711196.550000.33221
Pure metal layerGold (Au)7440-57-50.000260.350000.00120
Palladium (Pd)7440-05-30.002283.100000.01067
subTotal0.07365100.000000.34408
total21.40496100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.