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Chemical content 74AVC4T774GU

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Type numberPackagePackage descriptionTotal product weight
74AVC4T774GUSOT1161-1XQFN165.95563 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935341327184512601235Suzhou, China; Shanghai, China; Bangkok, Thailand 
935341327115712601235Shanghai, China; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0110760.000000.18587
ImpurityNon hazardousProprietary0.000010.039500.00012
PolymerResin systemProprietary0.0073739.951410.12377
subTotal0.01845100.000000.30976
DieDoped siliconSilicon (Si)7440-21-30.24849100.000004.17243
subTotal0.24849100.000004.17243
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.8044297.0000047.08848
Nickel (Ni)7440-02-00.086733.000001.45634
subTotal2.89115100.0000048.54482
Mould CompoundAdditiveNon hazardousProprietary0.073232.900001.22952
FillerSilica fused60676-86-02.2460188.9500037.71245
PigmentCarbon black1333-86-40.003790.150000.06360
PolymerEpoxy resin systemProprietary0.037121.470000.62324
Phenolic resinProprietary0.078533.110001.31856
Tetramethylbiphenyl diglycidyl ether85954-11-60.086363.420001.44999
subTotal2.52503100.0000042.39736
Pre-PlatingPure metal layerGold (Au)7440-57-50.001551.000000.02609
Nickel (Ni)7440-02-00.1413991.000002.37400
Palladium (Pd)7440-05-30.012438.000000.20870
subTotal0.15537100.000002.60879
WirePure metalGold (Au)7440-57-50.1159799.000001.94718
Palladium (Pd)7440-05-30.001171.000000.01967
subTotal0.11714100.000001.96685
total5.95563100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.