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Chemical content 74AVC8T245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AVC8T245BQ-Q100SOT815-1DHVQFN2451.12667 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300551118612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.19927
PolymerResin systemProprietary0.0253119.900000.04951
subTotal0.12719100.000000.24878
DieDoped siliconSilicon (Si)7440-21-30.64392100.000001.25946
subTotal0.64392100.000001.25946
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.9150697.4700036.99646
Iron (Fe)7439-89-60.465742.400000.91096
Phosphorus (P)7723-14-00.005820.030000.01139
Zinc (Zn)7440-66-60.019410.100000.03796
subTotal19.40603100.0000037.95677
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.67920
FillerSilica -amorphous-7631-86-91.029633.490002.01389
Silica fused60676-86-025.0239484.8200048.94499
PigmentCarbon black1333-86-40.047200.160000.09233
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.62321
Epoxy resin systemProprietary0.469091.590000.91750
Phenolic resinProprietary0.663802.250001.29835
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.13507
subTotal29.50241100.0000057.70454
Pre-PlatingPure metal layerGold (Au)7440-57-50.038813.000000.07591
Nickel (Ni)7440-02-01.1941092.300002.33558
Palladium (Pd)7440-05-30.040113.100000.07844
Silver (Ag)7440-22-40.020701.600000.04049
subTotal1.29372100.000002.53042
WirePure metalCopper (Cu)7440-50-80.1481196.550000.28968
Pure metal layerGold (Au)7440-57-50.000540.350000.00105
Palladium (Pd)7440-05-30.004763.100000.00930
subTotal0.15340100.000000.30003
total51.12667100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.