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Chemical content 74AVC8T245BQ

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Type numberPackagePackage descriptionTotal product weight
74AVC8T245BQSOT815-1DHVQFN2450.49532 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935284591118912601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.20176
PolymerResin systemProprietary0.0253119.900000.05013
subTotal0.12719100.000000.25189
DieDoped siliconSilicon (Si)7440-21-30.64392100.000001.27520
subTotal0.64392100.000001.27520
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.78235
Iron (Fe)7439-89-60.469762.400000.93031
Phosphorus (P)7723-14-00.005870.030000.01163
Zinc (Zn)7440-66-60.019570.100000.03876
subTotal19.57353100.0000038.76305
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.70020
FillerSilica -amorphous-7631-86-91.029633.490002.03907
Silica fused60676-86-025.0239484.8200049.55696
PigmentCarbon black1333-86-40.047200.160000.09348
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.63100
Epoxy resin systemProprietary0.469091.590000.92897
Phenolic resinProprietary0.663802.250001.31459
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.16176
subTotal29.50241100.0000058.42603
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00984
Nickel (Ni)7440-02-00.4521491.000000.89541
Palladium (Pd)7440-05-30.039758.000000.07872
subTotal0.49686100.000000.98397
WirePure metalCopper (Cu)7440-50-80.1461996.550000.28951
Pure metal layerGold (Au)7440-57-50.000530.350000.00105
Palladium (Pd)7440-05-30.004693.100000.00930
subTotal0.15141100.000000.29986
total50.49532100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.