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Chemical content 74AVC8T245BZ

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Type numberPackagePackage descriptionTotal product weight
74AVC8T245BZSOT8024-1DHXQFN2411.85471 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691147115612601235Bangkok, Thailand; Suzhou, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0231760.000000.19542
ImpurityNon hazardousProprietary0.000020.039500.00013
PolymerResin systemProprietary0.0154339.951410.13012
subTotal0.03861100.000000.32567
DieDoped siliconSilicon (Si)7440-21-30.28976100.000002.44429
subTotal0.28976100.000002.44429
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-85.4502297.0000045.97512
Nickel (Ni)7440-02-00.168563.000001.42191
subTotal5.61878100.0000047.39703
Mould CompoundAdditiveNon hazardousProprietary0.170192.900001.43566
FillerSilica fused60676-86-05.2202588.9500044.03527
PigmentCarbon black1333-86-40.008800.150000.07426
PolymerEpoxy resin systemProprietary0.086271.470000.72773
Phenolic resinProprietary0.182523.110001.53963
Tetramethylbiphenyl diglycidyl ether85954-11-60.200713.420001.69309
subTotal5.86875100.0000049.50564
Pre-PlatingPure metal layerGold (Au)7440-57-50.000291.000000.00248
Nickel (Ni)7440-02-00.0267391.000000.22545
Palladium (Pd)7440-05-30.002358.000000.01982
subTotal0.02937100.000000.24775
WirePure metalCopper (Cu)7440-50-80.0091196.550000.07682
Pure metal layerGold (Au)7440-57-50.000030.350000.00028
Palladium (Pd)7440-05-30.000293.100000.00247
subTotal0.00943100.000000.07957
total11.85471100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.