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Chemical content 74AVCH16T245DGG

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Type numberPackagePackage descriptionTotal product weight
74AVCH16T245DGGSOT362-1TSSOP48194.34351 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352862331181012601235Nijmegen, Netherlands; Bangkok, Thailand; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.3692080.100003.79184
PolymerResin systemProprietary1.8308019.900000.94204
subTotal9.20000100.000004.73388
DieDoped siliconSilicon (Si)7440-21-31.28784100.000000.66266
subTotal1.28784100.000000.66266
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.6500097.0000022.46023
Nickel (Ni)7440-02-01.350003.000000.69465
subTotal45.00000100.0000023.15488
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-7119.4750088.5000061.47620
Flame retardantNon hazardousProprietary4.050003.000002.08394
PolymerEpoxy resin systemProprietary11.475008.500005.90449
subTotal135.00000100.0000069.46463
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.01647
Nickel (Ni)7440-02-03.1040097.000001.59717
Palladium (Pd)7440-05-30.064002.000000.03293
subTotal3.20000100.000001.64657
WirePure metalGold (Au)7440-57-50.6491199.000000.33400
Palladium (Pd)7440-05-30.006561.000000.00337
subTotal0.65567100.000000.33737
total194.34351100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.