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Chemical content 74AXP8T245PW

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Type numberPackagePackage descriptionTotal product weight
74AXP8T245PWSOT355-1TSSOP2487.53249 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690812118512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1648177.900000.18829
PolymerAcrylic resinProprietary0.0321615.200000.03674
Resin systemProprietary0.014606.900000.01668
subTotal0.21157100.000000.24171
DieDoped siliconSilicon (Si)7440-21-30.87272100.000000.99703
subTotal0.87272100.000000.99703
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-834.7610397.4700039.71214
Iron (Fe)7439-89-60.855922.400000.97783
Phosphorus (P)7723-14-00.010700.030000.01222
Zinc (Zn)7440-66-60.035660.100000.04074
subTotal35.66331100.0000040.74293
Mould CompoundFillerSilica -amorphous-7631-86-90.295460.600000.33754
Silica fused60676-86-038.5722878.3300044.06624
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.003846.100003.43169
PigmentCarbon black1333-86-40.098490.200000.11251
PolymerEpoxy resin systemProprietary4.363948.862004.98551
Phenolic resinProprietary2.909295.908003.32367
subTotal49.24330100.0000056.25716
Pre-PlatingPure metal layerGold (Au)7440-57-50.041453.000000.04736
Nickel (Ni)7440-02-01.2754292.300001.45708
Palladium (Pd)7440-05-30.042843.100000.04894
Silver (Ag)7440-22-40.022111.600000.02526
subTotal1.38182100.000001.57864
WirePure metalCopper (Cu)7440-50-80.15977100.000000.18252
subTotal0.15977100.000000.18252
total87.53249100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.