Chemical content 74CBTLV3384BQ

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3384BQSOT815-1DHVQFN2450.32058 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352940831181012601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.20246
PolymerResin systemProprietary0.0253119.900000.05030
DieDoped siliconSilicon (Si)7440-21-30.48653100.000000.96686
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.91355
Iron (Fe)7439-89-60.469762.400000.93354
Phosphorus (P)7723-14-00.005870.030000.01167
Zinc (Zn)7440-66-60.019570.100000.03890
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.70610
FillerSilica -amorphous-7631-86-91.029633.490002.04615
Silica fused60676-86-025.0239484.8200049.72905
PigmentCarbon black1333-86-40.047200.160000.09381
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.63319
Epoxy resin systemProprietary0.469091.590000.93220
Phenolic resinProprietary0.663802.250001.31915
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.16927
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00987
Nickel (Ni)7440-02-00.4521491.000000.89852
Palladium (Pd)7440-05-30.039758.000000.07899
WirePure metalCopper (Cu)7440-50-80.1294496.550000.25723
Pure metal layerGold (Au)7440-57-50.000470.350000.00093
Palladium (Pd)7440-05-30.004163.100000.00826
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.