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Chemical content 74CBTLVD3245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74CBTLVD3245BQ-Q100SOT764-1DHVQFN2028.35735 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307651115612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24089
PolymerResin systemProprietary0.0169719.900000.05985
subTotal0.08528100.000000.30074
DieDoped siliconSilicon (Si)7440-21-30.68114100.000002.40198
subTotal0.68114100.000002.40198
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.34113
Iron (Fe)7439-89-60.260732.400000.91945
Phosphorus (P)7723-14-00.003260.030000.01149
Zinc (Zn)7440-66-60.010860.100000.03831
subTotal10.86381100.0000038.31038
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68038
FillerSilica -amorphous-7631-86-90.571483.490002.01530
Silica fused60676-86-013.8892184.8200048.97921
PigmentCarbon black1333-86-40.026200.160000.09239
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62364
Epoxy resin systemProprietary0.260361.590000.91814
Phenolic resinProprietary0.368442.250001.29926
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13656
subTotal16.37492100.0000057.74488
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00973
Nickel (Ni)7440-02-00.2509691.000000.88499
Palladium (Pd)7440-05-30.022068.000000.07780
subTotal0.27578100.000000.97252
WirePure metalCopper (Cu)7440-50-80.0737996.550000.26020
Pure metal layerGold (Au)7440-57-50.000270.350000.00094
Palladium (Pd)7440-05-30.002373.100000.00835
subTotal0.07642100.000000.26949
total28.35735100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.