Chemical content 74CBTLVD3861PW

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Type numberPackagePackage descriptionTotal product weight
74CBTLVD3861PWSOT355-1TSSOP2487.85461 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352940951187126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1041380.100000.11853
PolymerResin systemProprietary0.0258719.900000.02945
DieDoped siliconSilicon (Si)7440-21-30.68114100.000000.77530
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-830.5081197.4700034.72568
Iron (Fe)7439-89-60.751202.400000.85505
Phosphorus (P)7723-14-00.009390.030000.01069
Zinc (Zn)7440-66-60.031300.100000.03563
Mould CompoundAdditiveNon hazardousProprietary2.581714.700002.93862
FillerSilica fused60676-86-043.3947079.0000049.39377
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.295806.000003.75143
PigmentCarbon black1333-86-40.109860.200000.12505
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.197204.000002.50095
Non hazardousProprietary2.252134.100002.56347
Tetramethylbiphenyl diglycidyl ether85954-11-61.098602.000001.25048
Pre-PlatingPure metal layerGold (Au)7440-57-50.006301.000000.00717
Nickel (Ni)7440-02-00.6111097.000000.69558
Palladium (Pd)7440-05-30.012602.000000.01434
WirePure metalCopper (Cu)7440-50-80.18347100.000000.20883
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.