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Chemical content 74HC00PW

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Type numberPackagePackage descriptionTotal product weight
74HC00PWSOT402-1TSSOP1451.82881 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351741101181212601235Hsin-chu, Taiwan; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06012
PolymerAcrylic resinProprietary0.0060815.200000.01173
Resin systemProprietary0.002766.900000.00533
subTotal0.04000100.000000.07718
DieDoped siliconSilicon (Si)7440-21-30.18786100.000000.36246
subTotal0.18786100.000000.36246
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.74720
Iron (Fe)7439-89-60.468962.400000.90482
Phosphorus (P)7723-14-00.005860.030000.01131
Zinc (Zn)7440-66-60.019540.100000.03770
subTotal19.54000100.0000037.70103
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.87284
FillerSilica fused60676-86-025.0272079.0000048.28820
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.66746
PigmentCarbon black1333-86-40.063360.200000.12225
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.44497
Non hazardousProprietary1.298884.100002.50610
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.22249
subTotal31.68000100.0000061.12431
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00560
Nickel (Ni)7440-02-00.2813097.000000.54275
Palladium (Pd)7440-05-30.005802.000000.01119
subTotal0.29000100.000000.55954
WirePure metalCopper (Cu)7440-50-80.09096100.000000.17550
subTotal0.09096100.000000.17550
total51.82881100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.