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Chemical content 74HC05BQ

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Type numberPackagePackage descriptionTotal product weight
74HC05BQSOT762-1DHVQFN1418.00558 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352897471151112601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10347
PolymerResin systemProprietary0.0046319.900000.02571
subTotal0.02326100.000000.12918
DieDoped siliconSilicon (Si)7440-21-30.25346100.000001.40766
subTotal0.25346100.000001.40766
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.78258
Iron (Fe)7439-89-60.167512.400000.93032
Phosphorus (P)7723-14-00.002090.030000.01163
Zinc (Zn)7440-66-60.006980.100000.03876
subTotal6.97956100.0000038.76329
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70021
FillerSilica -amorphous-7631-86-90.367153.490002.03908
Silica fused60676-86-08.9230684.8200049.55722
PigmentCarbon black1333-86-40.016830.160000.09348
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63100
Epoxy resin systemProprietary0.167271.590000.92898
Phenolic resinProprietary0.236702.250001.31459
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16177
subTotal10.52000100.0000058.42633
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00984
Nickel (Ni)7440-02-00.1612391.000000.89545
Palladium (Pd)7440-05-30.014178.000000.07872
subTotal0.17718100.000000.98401
WirePure metalCopper (Cu)7440-50-80.0503396.550000.27955
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001623.100000.00898
subTotal0.05213100.000000.28954
total18.00558100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.